Precision Laser Cutting, drilling, scribing on ceramic substrates

Ceramic is a kind of functional material with high melting point, high hardness, high wear resistance and oxidation 

resistance. stiffness, strength, plasticity free, high thermal stability and high chemical stability, it’s also a good

insulator and become the the standard materials for electronic circuit carriers. It is often used in military industry, 

aerospace, high-end PCB, 3C industry and so on, mainly include oxide ceramics, carbide ceramics, metal ceramics, 

nitride ceramics, etc., with special mechanical, optical, acoustic, electrical, magnetic, thermal and other characteristics.

Due to the ceramic material's function and characteristics, it require high precision processing, high quality, fast 

speed. The traditional machining is mainly CNC machining, the speed and accuracy is low, which is not suitable for 

high precision processing demand. So the laser cutting technology is developed for ceramic cutting, scribing, drilling.

Beyond Laser launched new picosecond laser machine for precision cutting, scribing and drilling ceramic substrates 

for both thick and thin film, aluminium nitride for hybrid circuits as well as laser processed ceramics for lids, 

frames, packages, jigs, fixtures, guides, wear plates, cores, thermal and electrical insulators, spacers, washers, 

test pieces, kiln supports and wave guides.

Laser Scribing of Ceramic Substrates, Ceramics laser cutting, Ceramic laser drilling

Picosecond laser scribing of ceramic substrates shows the best results for heat sensitive materials fabrication. Ablated grooves seem to be homogeneous, and the wall of the groove least affected, when using special technology developed especially for this kind of materials.

● No heat affected zones and melted layers

● Grooves of less than 15 μm widths and more than 25 μm depth

● No overshooting in intersections

● Better than 0.5 μm accuracy within 40 mm area

● Fabricating up to 9 samples without any operator interference

● Controlling the fabrication process for up to 24 hours long and maintaining needed accuracy, compensating beam and mechanical drift within 0,5 μm

The advantage of picosecond laser cutting on ceramic material

The advantage of picosecond laser cutting on ceramic material is mainly owe to pulse width, the instantaneous power in unit time of 1ps is very high, which can penetrate the material surface ultra-fast. Since the time is short, the contact impact on material is very small, also means that the damage is minimized and the cutting quality is best compared with other laser source, it has the ideal cutting quality, and faster cutting speed.

Laser cutting ceramic is non-contact machining, no stress, small laser spot, which means high cutting precision. Compared with CNC machining, CNC has material contact on processing, more damage on material and with lower accuracy.